SOLARWIND INTERNATIONAL
We have implemented six new service lines of business to further assist our customers
with the processing and manufacturing of silicon materials.

• Sorting: visual, marks, films, metals, type, resistivity, thickness, size, edge, flats

• Slicing: Solar grade & semiconductor grade ingots

• Wafer downsizing: Laser cutting of wafers to any diameter (retaining Notch and Flat)

• Laser Scribing: Semi grade lettering

• Annealing: All diameter and thickness

• Edge grinding: All diameter and most thickness

• Lapping: All diameters to most thicknesses

• Back-grinding: All diameter and most thicknesses

• Etching: KOH caustic etch to strengthen wafers and remove subsurface damage.

• Dicing: All Diameter and most thicknesses

• Chemical: Stripping: All organic films

• Mechanical Stripping: Proprietary wafers pattern removal (will provide Certificate of
Damage)

• Polishing: Diameters from 25 to 300mm

• Cleaning: Diameters from 25 to 300mm SC-1( Organics ) SC-2 (Inorganic)

• Packaging: Class 100 Clean room standards double bag packaging